Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Angie V.
> 3 dayConsiderable reduction in temperature of processor.
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Lyric Bernier
> 3 dayWas using some cheap stuff and thermal margin was dropping below 10, applied this and now im stable on 30 at max load. worked well
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Jon A.
> 3 dayive been using this thermal paste for 3 years and its never let me down. no curing time is a big plus.
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Jevon Browne
> 3 dayIn my case, Im using a SFF build and it gets really hot inside, especially while gaming. Before, my CPU temps got up to 79deg depending on the game. But after changing the thermal paste and fan my temps dropped by as much 12deg. To be fair I also changed out my 140mm x15mm cooler fan for 140mm x 25mm with about 10+ increase on the CFM rating.
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M_dH
Greater than one weekIt spreads nicely and stays put.
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Neeraj
13-06-2025Excellent thermal Compound in cheap price, recommended for Laptop if shutting down ownself by heat issue. Applying it is quite easy. Excellent results
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Darchful
> 3 dayTop 10 entre las pastas térmicas desde hace años. Calidad-precio-prestaciones dentro de las 10 mejores del mercado. Recomiendo 100%. Funcionalidad a largo plazo. Algo más de un año aguanta, diría entre 1 año y medio y 2 años.
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G.
> 3 dayFacile à employer, efficacité garantie !
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Ricardo
> 3 dayPara procesadores y gpu
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JerryF504
> 3 dayReplace the thermal paste on my 7 year old CPU. It actually runs about 5-7 degrees cooler.
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
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