Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Cordier Serge
16-11-2024Conforme à ce que je mattendais, pate thermique de très bonne qualité. A acheter les yeux fermés,rapport qualité prix imbattable.
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Mr. Ethan O'Hara I
> 3 dayFacile à appliquer, et efficacité perceptible à loreille. Mes deux ventilos de CM et de CG ont soudain fait place à un silence bienvenu.
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Nero
> 3 dayNoctua ist für mich die Nummer 1.
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Mykaël
> 3 dayThat thermal paste does its job. It keeps a nice contact between the cpu and the cooler. Easy to apply too which is a big plus.
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Alex
> 3 day10/10
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Alexandre
> 3 dayJ’ai changer la pâte thermique de ma PS4 et depuis silence total
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Punam Singh
> 3 dayCPU temperature dropped to 45-50C range which was earlier always above 50-60C, Intel XTU stress test resulted in max CPU to 87C after application of this compound, earlier it was going upto 98C during same stress tests.
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George V.
> 3 dayA no brained choice for thermal paste. However this is a premium product.
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E.G
21-11-2024Je lai acheté pour changer la date thermique de la playstation de mes enfants qui faisait un bruit davion malgré lavoir totalement dépoussiérée. La play ne fait plus aucun bruit. Pas besoin den mettre plus dune goute. Je suis ravie de cet achat.
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Prof. Retha Jakubowski PhD
> 3 dayWorks great, at a very good price. Also not thick or viscous so easy to work with.
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |