Noctua NT-H2 3.5g, Thermal Computer Paste incl. 3 Cleaning Wipes (3.5g)
-
Cleyet-Merle
> 3 dayTrès bonne pâte thermique je recommande et les lingette le top pour nettoyer le processeur
-
Kursley Eugene
> 3 dayJai acheter il y a quelques temps le modèle H1 et jétais agréablement surpris par les performances mais la le H2 fait encore mieux !
-
Michelle Santos
> 3 dayGreat product, provides amazing thermal layer to help with heat dissipation! Worth every dollar!
-
shane huse
> 3 daygot a lot of reviews to do so yeah copy paste 5 stars!!!!
-
Fatos
20-11-2024This is honestly a great paste. I‘ve been struggling with the temperatures of my laptop for 2 years now with temperatures over 93C(laptop HP Omen 17– CPU: Intel I7-9750H). After I applied this paste my temperatures now never go over 78C, and with a bit of undervolting now my laptop doesn‘t even go past 73C.
-
ROSARIO
> 3 dayConsegnata da Amazon in meno di 24 ore per di più di domenica, impressionante.
-
Jeff
> 3 dayI replaced the stock compound on my Legion laptop with this. It dropped max temperatures by about 10° C.
-
A
> 3 dayIch bin sehr zufrieden mit der Wärmeleitpaste.
-
Vincent ARMENIO
> 3 dayUtilisé pour ma xbox one x. Elle est redevenue silencieuse comme quand elle était neuve!
-
Main
> 3 dayThe included cleaning cloth:
NT-H2 is the further improved second generation of Noctua’s award-winning hybrid thermal compound. Combining the iconic NT-H1’s proven features, superb ease-of-use and renowned long-term stability with a novel, fine-tuned formula of micro particles for even better thermal performance, NT-H2 is an enthusiast-grade paste for the highest demands. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results and thanks to the included cleaning wipes, it is just as easy to remove as to apply.
Next-generation performance
Further improving the award-winning NT-H1, NT-H2 uses a new, fine-tuned mixture of metal oxide micro-particles for even lower thermal resistance and reduced bond-line thickness at typical mounting pressures. This allows it to achieve even better performance in most application scenarios.
|
|
|
|
|
|---|---|---|---|
Easy to clean with included wipesThe 3.5g pack of NT-H2 includes three large NA-CW1 cleaning wipes that are pre-moistened with an isopropyl alcohol mixture and make it child’s play to remove: Simply wipe off the paste from the CPU and the base of the cooler using one of the wipes and you’re done! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H2 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H2 unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H2 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
|
|
|
|
|
|
|
|---|---|---|---|---|---|---|
| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description: | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size: | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume: | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density: | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes: | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
Related products
